实时监测跨内皮电阻的热塑性芯片器件的筛印电极的快速融合。
Rapid integration of screen-printed electrodes into thermoplastic organ-on-a-chip devices for real-time monitoring of trans-endothelial electrical resistance.
发表日期：2023 Sep 23
作者：
Satoru Kawakita, Shaopei Li, Huu Tuan Nguyen, Surjendu Maity, Reihaneh Haghniaz, Jamal Bahari, Ning Yu, Kalpana Mandal, Praveen Bandaru, Lei Mou, Menekse Ermis, Enam Khalil, Safoora Khosravi, Arne Peirsman, Rohollah Nasiri, Annie Adachi, Aya Nakayama, Remy Bell, Yangzhi Zhu, Vadim Jucaud, Mehmet Remzi Dokmeci, Ali Khademhosseini
来源：
Environmental Technology & Innovation
摘要：
穿过内皮层的电阻（TEER）是量化内皮层屏障完整性的最常用指标之一。在过去的十年中，将TEER传感器集成到器官芯片（OOC）平台中，以便在OOC中高效有效地测量TEER，一直受到越来越多的关注。目前，微加工电极或直接插入导线已被用于将TEER传感器集成到OOC中，每种方法都有其优势和劣势。在本研究中，我们开发了一个包含基于碳的丝网印刷电极（SPE）的TEER-SPE芯片，该芯片嵌入了基于聚甲基丙烯酸甲酯（PMMA）的多层微流体装置，并在两者之间放置了多孔的聚对苯二甲酸乙二酯（PET）膜。作为概念证明，我们成功地在TEER-SPE芯片中培养了hCMEC/D3细胞并形成了密实的单层。此外，TEER-SPE芯片能够检测由剪切应力或炎症因子（如肿瘤坏死因子-α）导致的屏障完整性变化。这种新方法实现了在PMMA基底上低成本和简便地制造基于碳的SPE，并在快速原型制造过程中组装PMMA层。我们的方法具有成本效益且无需无尘室，降低了现有的后勤和技术障碍，为更广泛应用具有TEER测量能力的OOC迈出了另一步。© 2023. 作者，独家许可给Springer Science+Business Media, LLC，Springer Nature的一部分。
Trans-endothelial electrical resistance (TEER) is one of the most widely used indicators to quantify the barrier integrity of endothelial layers. Over the last decade, the integration of TEER sensors into organ-on-a-chip (OOC) platforms has gained increasing interest for its efficient and effective measurement of TEER in OOCs. To date, microfabricated electrodes or direct insertion of wires has been used to integrate TEER sensors into OOCs, with each method having advantages and disadvantages. In this study, we developed a TEER-SPE chip consisting of carbon-based screen-printed electrodes (SPEs) embedded in a poly(methyl methacrylate) (PMMA)-based multi-layered microfluidic device with a porous poly(ethylene terephthalate) membrane in-between. As proof of concept, we demonstrated the successful cultures of hCMEC/D3 cells and the formation of confluent monolayers in the TEER-SPE chip and obtained TEER measurements for 4 days. Additionally, the TEER-SPE chip could detect changes in the barrier integrity due to shear stress or an inflammatory cytokine (i.e., tumor necrosis factor-α). The novel approach enables a low-cost and facile fabrication of carbon-based SPEs on PMMA substrates and the subsequent assembly of PMMA layers for rapid prototyping. Being cost-effective and cleanroom-free, our method lowers the existing logistical and technical barriers presenting itself as another step forward to the broader adoption of OOCs with TEER measurement capability.© 2023. The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.